中国科学院深圳先进技术研究院机构知识库(SIAT OpenIR): Comparative study of anhydride-based and amine-based underfill materials for flip chip applications
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Comparative study of anhydride-based and amine-based underfill materials for flip chip applications
Gang Li; Pengli Zhu; Qian Guo; Tao Zhao; Daniel Lu; Rong Sun; Chingping Wong
2016
Conference NameChina Semiconductor Technology International Conference 2016, CSTIC 2016
Conference PlaceShanghai, China
Abstractas hardeners in underfill materials for flip chip packaging. A comparison was made between these two systems in order to evaluate the comprehensive performance of the resulting underfill. It was found that the addition of multi-size silica particles has little effect on the curing reaction of the epoxy mixture while a significant effect on increasing the viscosity, storage modulus, Tg and lowering the CTE and the magnitude of the tanδ peak with the increase of SiO2 loading for both anhydride and amine curing system. Moreover, with the same filler loading, compared with the amine based underfill, the anhydride system exhibited much lower viscosity, glassy modulus, and CTE in the glassy region and lower Tg thus showing a potential for flip chip underfilling applications.
Department先进材料研究中心
Indexed ByEI
Language英语
Document Type会议论文
Identifierhttp://ir.siat.ac.cn/handle/172644/10100
Collection集成所
Affiliation2016
Recommended Citation
GB/T 7714
Gang Li,Pengli Zhu,Qian Guo,et al. Comparative study of anhydride-based and amine-based underfill materials for flip chip applications[C],2016.
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